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Shear Bond Strength of Different MDP-Containing Adhesive Systems on Enamel and Dentin from Primary Teeth
1Department of Pediatric Dentistry, Dental Research Institute, School of Dentistry, Seoul National University, Seoul, Korea
2Department of Dental Biomaterials Science Dental Research Institute, School of Dentistry, Seoul National University, Seoul, Korea
*Corresponding Author(s): Hong-Keun Hyun E-mail: hege1@snu.ac.kr
Objective: To compare the shear bond strength (SBS) after thermocycling of four universal adhesives applied in self-etch mode on dentin and etch-and-rinse mode on enamel. Study design: Flat 144 buccal or lingual dentin and enamel surfaces from 72 non-carious primary molars were prepared. Samples were segregated into 12 groups (n=12): Adper Single Bond 2 etch-and-rinse (SB_T) and Clearfil SE Bond self-etch (SE_S) applied to enamel and dentin served as controls. Scotch Bond Universal Adhesive (SBU), Clearfil S3 Bond Universal Adhesive (SEU), Tetric N-Bond Universal Adhesive (TEN), and All Bond Universal (BIS) were applied in etch-and-rinse mode to enamel and in self-etch mode to dentin. They were thermocycled for 5000 cycles. SBS testing and the evaluation of fracture mode were performed. Results: SB_T showed statistically higher SBS than other adhesive groups using etch-and-rinse mode on enamel. SE_S and BIS had statistically higher SBS than other adhesive groups using self-etch mode on dentin. Mixed failure was the most common failure mode in each group. Conclusion: The universal adhesives did not show higher SBS than SB_T when using etch-and-rinse on enamel. All universal adhesives showed higher SBS than SB_T and had SBS similar to SE_S, except SBU when using self-etch mode on dentin.
Universal adhesive; Shear bond strength; Selective etching; Thermocycling, Primary Teeth
Min Jin Kim,Joonhee Kim,Ji-Soo Song,Shin Hye Chung,Hong-Keun Hyun. Shear Bond Strength of Different MDP-Containing Adhesive Systems on Enamel and Dentin from Primary Teeth. Journal of Clinical Pediatric Dentistry. 2021. 45(3);186-192.
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